SK hynix invests over $4 billion in Indiana HBM advanced packaging plant

Reuters2026/08/27 16:26

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SK hynix broke ground on an advanced packaging plant in Indiana to support next-generation HBM for AI.
Total investment expected to exceed USD 4 billion; cleanroom targeted for October 2028.
Mass production slated for H2 2029, marking its first “Made in USA” next-generation HBM output.
Korea-made wafers will be shipped to Indiana for packaging, testing, then supplied to U.S. customers.
Project includes an on-site R&D testbed; buildout aims to support about 7,000 jobs during construction and operations.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. SK Hynix Inc. published the original content used to generate this news brief via PR Newswire (Ref. ID: CN35174) on August 27, 2026, and is solely responsible for the information contained therein.

Disclaimer: The content of this article solely reflects the author's opinion and does not represent the platform in any capacity. This article is not intended to serve as a reference for making investment decisions.

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SK hynix invests over $4 billion in Indiana HBM advanced packaging plant

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