ASE Technology introduces 310mm panel-level package automation, aims for mass production in the first half of next year

Golden Ten Data reported on May 27 that ASE Technology Holding's subsidiary, ASE Semiconductor, announced the development of the industry's first 310mm × 310mm Panel-Level Packaging (PLP) automated production line. This production line achieves seamless integration from wafer-level packaging to panel-level packaging and is compatible with both FOCoS (Fan-Out Chip on Substrate) and FOCoS-Bridge packaging platform design standards, helping to enhance economies of scale. This new panel-level packaging production line is expected to officially commence production in the first half of 2027.